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INTEGRATED CIRCUITS
DATA SHEET
TDA1552Q 2 x 22 W BTL stereo car radio power amplifier
Product specification File under Integrated Circuits, IC01 July 1994
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
GENERAL DESCRIPTION
TDA1552Q
The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for car radio applications. Features * Requires very few external components * High output power * Low offset voltage at outputs * Fixed gain * Good ripple rejection * Mute/stand-by switch * Load dump protection * AC and DC short-circuit-safe to ground and VP QUICK REFERENCE DATA PARAMETER Supply voltage range operating non-operating load dump protected Repetitive peak output current Total quiescent current Stand-by current Switch-on current Input impedance Junction temperature Stereo application Output power Supply voltage ripple rejection DC output offset voltage Channel separation Channel unbalance RS = 0 f = 100 Hz to 10 kHz RR |VO| |Gv| 48 - 40 - - - - - - 150 - 1 dB mV dB dB RL = 4 ; THD = 10% Po 20 22 - W IORM Itot Isb Isw |ZI| Tj - - - - 50 - - 80 0.1 - 60 - 4 160 100 60 75 150 A mA A A k C VP VP VP 6.0 - - 14.4 - - 18.0 30 45 V V V CONDITIONS SYMBOL MIN. TYP. MAX. UNIT * Thermally protected * Reverse polarity safe * Capability to handle high energy on outputs (VP = 0 V) * Protected against electrostatic discharge * No switch-on/switch-off plop * Low thermal resistance * Flexible leads.
PACKAGE OUTLINE 13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23.
July 1994
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
handbook, full pagewidth
V P1 3 input 1 1 mute switch Cm
V P2 10
VA 2 k 18 k power stage mute switch
4
output 1A
Cm
VA 60 k 2 k 18 k VP power stage
6
output 1B
11 stand-by switch VA stand-by reference voltage 12
mute/stand-by not connected
15 k x1 mute switch 15 k V ref 13 mute switch Cm
TDA1552Q
input 2
VA 2 k 18 k power stage mute switch
9
output 2B
Cm
VA 60 k 2 k 18 k power stage 5 GND1 ground (signal) power ground (substrate) 8 GND2
7
output 2A
Vref
2
MLB952
Fig.1 Block diagram.
July 1994
3
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
PINNING 1 2 3 4 5 6 7 IP1 GND VP1 OUT1A GND1 OUT1B OUT2A input 1 ground (signal) positive supply voltage 1 output 1A power ground 1 (substrate) output 1B output 2A 8 9 10 11 12 13 GND2 OUT2B VP2 M/SS n.c. IP2
TDA1552Q
power ground 2 (substrate) output 2B positive supply voltage 2 mute/stand-by switch not connected input 2
FUNCTIONAL DESCRIPTION The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications. The gain of each amplifier is fixed at 26 dB. A special feature of this device is: Mute/stand-by switch * low stand-by current (< 100 A) * low mute/stand-by switching current (low cost supply switch) * mute facility. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage operating non-operating load dump protected Non-repetitive peak output current Repetitive peak output current Storage temperature range Junction temperature AC and DC short-circuit-safe voltage Energy handling capability at outputs Reverse polarity Total power dissipation see Fig.2 VP = 0 V VPR Ptot during 50 ms; tr 2.5 ms VP IOSM IORM Tstg Tj VPSC - - - -55 - - - - - 45 6 4 +150 150 18 200 6 60 V A A C C V mJ V W VP VP - - 18 30 V V CONDITIONS SYMBOL MIN. MAX. UNIT
July 1994
4
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
Fig.2 Power derating curve.
July 1994
5
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measurements taken using Fig.3; unless otherwise specified PARAMETER Supply Supply voltage range Total quiescent current DC output voltage DC output offset voltage Mute/stand-by switch Switch-on voltage level Mute condition Output signal in mute position DC output offset voltage (between pins 4 to 6 and 7 to 9) Stand-by condition DC current in stand-by condition Switch-on current Supply current short-circuit to GND note 3 IP - 5.5 VII < 0.5 V 0.5 V VII < 2 V |VO| Vsb Isb Isb Isw - 0 - - - - - - - 25 VI = 1 V (max); f = 1 kHz VO - - VON Vmute 8.5 3.3 - - note 2 note 1 VP Itot VO |VO| 6.0 - - - 14.4 80 6.9 - CONDITIONS SYMBOL MIN. TYP.
TDA1552Q
MAX.
UNIT
18.0 160 - 150 - 6.4
V mA V mV
V V
2 150 2 100 500 60
mV mV V A A A
-
mA
July 1994
6
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; measurements taken using Fig.3; unless otherwise specified PARAMETER Output power Output power at VP = 13.2 V Total harmonic distortion Power bandwidth CONDITIONS THD = 0.5% THD = 10% THD = 0.5% THD = 10% Po = 1 W THD = 0.5% Po = -1 dB w.r.t. 15 W Low frequency roll-off High frequency roll-off Closed loop voltage gain Supply voltage ripple rejection ON mute stand-by Input impedance Noise output voltage (RMS value) ON ON mute Channel separation Channel unbalance Notes to the characteristics 1. The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V. 2. At 18 V < VP < 30 V the DC output voltage VP/2. 3. Conditions: a) V11 = 0 V b) short-circuit to GND c) switch V11 to MUTE or ON condition (rise time 10 s). 4. Frequency response externally fixed. 5. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V). 6. Frequency f = 100 Hz. 7. Frequency between 1 kHz and 10 kHz. 8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 9. Noise output voltage independent of RS (VI = 0 V). July 1994 7 RS = 0 ; note 8 notes 8, 9 Vno(rms) Vno(rms) |Gv| - - 40 70 100 60 - - 120 - - - 1 V V A dB dB RS = 10 k; note 8 Vno(rms) notes 5, 6 notes 5, 7 notes 5, 6, 7 notes 5, 6, 7 note 4 -1 dB -1 dB fL fH Gv RR RR RR RR |Zi| - 20 25 42 48 48 80 50 25 - 26 - - - - 60 - - 27 - - - - 75 Hz kHz dB dB dB dB dB k Bw 20 to 15000 - Hz SYMBOL Po Po Po Po THD MIN. 15 20 - - - TYP. 17 22 12 17 0.1 - - - - MAX. UNIT W W W W %
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
APPLICATION INFORMATION
TDA1552Q
handbook, full pagewidth
mute/stand-by switch not connected
VP 100 nF 2200 F
14.4 V
12 220 nF input 1
11
3
10
1 4
60 k 6
R =4 L
ground (signal)
2
TDA1552Q
reference voltage
220 nF input 2
13 9
60 k 7
R =4 L
5
8
MLB951
power ground (substrate)
Fig.3 Application circuit diagram.
July 1994
8
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
TDA1552Q
SOT141-6
non-concave x D Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c
1 Z e e1 bp wM
13 m e2 vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
July 1994
9
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1552Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994
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